This presentation will showcase WEAM’s versatility across applications:
- Radome heating for automotive and aerospace—demonstrated on the Polestar 3 front panel, delivering precise wire positioning and energy-efficient de-icing.
- thin, stretchable TPU circuit boards—enabling complex 3D geometries, modular electronics, and heat-lamination onto textiles, metals, and polymers for wearables and interiors.
- Integration of sensors, actuators, and EMC shielding—all within a single automated process for lightweight, sustainable components.
Join us to explore how WEAM combines design freedom, functional density, and cost-efficiency for next-generation manufacturing in automotive, aerospace, defense, and consumer electronics.
Speakers:
Lukas Boxberger, Head of Department Functionalization Technologies, Fraunhofer IWU
Fabian Ziervogel, Research Associate, Fraunhofer IWU