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A new ASA (Acrylonitrile-Styrene-Acrylate) conductive filament for 3D printing electronic devices

Currently, the introduction of printed electronics onto plastic parts in the automotive and aerospace sectors is achieved through a process known as In Mold-Electronics (IME). This process involves printing a flexible electrical circuit onto a flat plastic substrate using conductive ink, typically through screen printing.

However, this process has several drawbacks, including the high cost of the mold and limitations on the allowed angles. Additionally, this manufacturing method involves multiple intermediate processes to obtain the final part. Recent advancements in additive manufacturing have sparked a revolution within the industrial landscape. Additive manufacturing emerges as a viable alternative to IME; however, it requires high-performance functional materials that can be printed using Fused Deposition Modelling (FDM) in combination with another non functional plastic. The main objective of this work is to demonstrate the manufacturing capabilities and potential applications of a new conductive ASA material developed by Naitec. ASA is a polymer commonly used in various industries, especially automotive, household appliances, and consumer goods. Additionally, the resistivity of this new material is 0.006 Ωcm without requiring post-treatment for proper functionality. This innovative material enables the production of functional electronic devices, such as power transmission paths, capacitive buttons, or horn antennas, by combining the conductive material and the core material in a single printing step.

The speaker is:
Dr. Javier Bravo Larrea, Researcher, NAITEC ( Fundación I+D Automoción y Mecatrónica)

Tags

  • Automotive