Rogal® Select Cu 99,95 S | Pure Copper Alloy for Additive Manufacturing

Rogal® Select Cu99.95 S is an inert gas atomized powder which combines perfect spherical morphology, a high metallurgical purity, and a very low oxygen content. Thanks to a contactless melting process, the powder is free of ceramic contamination. These properties guarantee homogeneous microstructures in the additive manufactured components including an excellent electrical and thermal conductivity.

Due to the customized powder characteristics, Rogal® Select Cu99.95 S is suitable for a wide range of Additive Manufacturing technologies such as Laser Based Powder Bed Fusion (LPBF), Cold Gas Spray (CGS) and Metal Binder Jetting (MBJ).

Typical AM applications include heat exchangers as well as electrical and electronic components.

Properties & Benefits of Rogal® Select Cu99.95 S

• Manufacturing process: Inert gas atomization
• Powder morphology: Spherical
• High copper purity: ≥ 99.95%
• Very low oxygen content: < 0.04%
• No ceramic contamination

Contact us via am@schlenk.de to get more details regarding Rogal® Select Cu99.95 S.

Rogal® Select Copper Alloy Powders for Additive Manufacturing

Available Alloys:

• Rogal® Select CuCr1Zr S

• Rogal® Select CuNi2SiCr S

• Rogal® Select CuAl10Ni5Fe4 S

• Rogal® Select CuSn8 S

Product Features:

• Inert gas atomized for optimal particle morphology

• Spherical particle shape for excellent flowability

• Very low oxygen content

• Free from ceramic impurities

• High metallurgical purity for stable and repeatable processes

Applications:
Suitable for Laser Powder Bed Fusion (LPBF), Cold Gas Spray (CGS) and Metal Binder Jetting (MBJ).

Contact us via am@schlenk.de to get more details regarding Rogal® Select Copper Alloy Powders.